Framework Laptop 13.5 Ryzen AI 9 HX 370
Specifications
Framework Laptop 13.5 Ryzen AI 9 HX 370 (Laptop Series)
Processor
AMD Ryzen AI 9 HX 370 12c/24t, 4 x 5.1 GHz AMD Zen 5, 8 x 3.3 GHz AMD Zen 5c, 46 W PL2 / Short Burst, 28 W PL1 / Sustained, Strix Point-HX (Zen 5/5c)
Graphics adapter
AMD Radeon 890M, Core: 2225 MHz, RAM: 2800 MHz, DDR5, 32.0.13026.0
Memory
32 GB
, DDR-5600, 46-45-45-90, Dual-Channel, ADATA
Display
13.50 inch 3:2, 2880 x 1920 pixel 256 PPI, BOE NE135A1M-NY1, IPS, BOE0CB4, glossy: no, 120 Hz
Mainboard
AMD Promontory/Bixby FCH
Soundcard
AMD Zen - Audio Processor - HD Audio Controller
Connections
2 USB 3.2 Gen 2x2 20Gbps, 2 USB4 40 Gbps, 2 Thunderbolt, USB-C Power Delivery (PD), 4 DisplayPort, Audio Connections: 3.5 mm combo, Card Reader: MicroSD, Brightness Sensor
Networking
Mediatek RZ717 WiFi 7 160 MHz (a/b/g/n = Wi-Fi 4/ac = Wi-Fi 5/ax = Wi-Fi 6/ Wi-Fi 6E 6 GHz be = Wi-Fi 7), Bluetooth 5.4
Size
height x width x depth (in mm): 15.85 x 296.63 x 228.98
Battery
61 Wh Lithium-Polymer
Operating System
Microsoft Windows 11 Pro
Camera
Webcam: 1080p30
Primary Camera: 2.1 MPix
Primary Camera: 2.1 MPix
Additional features
Speakers: Stereo, Keyboard: Chiclet, Keyboard Light: yes, Screwdriver, 12 Months Warranty
Weight
1.341 kg, Power Supply: 333 g
Price
2100 USD
Price comparison
Average Score:
Average of 2 scores (from 1 reviews)
Average of 2 scores (from 1 reviews)
price: - %, performance: 70%, features: 74%, display: 82% mobility: 75%, workmanship: 78%, ergonomy: 85%, emissions: 84%
Reviews for the Framework Laptop 13.5 Ryzen AI 9 HX 370
框架笔记本 13.5 Ryzen AI 9 评测：跳过英特尔版本，获得更佳性能 | Notebookcheck
以可持续发展为名，Framework 正在从其老化的设计中榨取尽可能多的资源。就原始性能而言，它的大部分工作都比预期的要好，但我们仍希望看到一些关键功能。
以可持续发展为名，Framework 正在从其老化的设计中榨取尽可能多的资源。就原始性能而言，它的大部分工作都比预期的要好，但我们仍希望看到一些关键功能。
Nachhaltigkeit hat ihren Preis
Source: PC Welt
DE→zh-CN
Single Review, online available, Long, Date: 05/28/2025
Rating: Total score: 70%
Source: PC Welt
DE→zh-CNSingle Review, online available, Long, Date: 05/28/2025
Rating: Total score: 70%
Comment
AMD Radeon 890M: 强大的 RDNA 3+ 架构 iGPU 于 2024 年 6 月首次亮相。
» Further information can be found in our Comparison of Mobile Graphics Cards and the corresponding Benchmark List.
Ryzen AI 9 HX 370: 一款功能强大的 Strix Point 系列芯片，预计将于 2024 年 6 月亮相。据说这款 APU 配备 12 个 CPU 内核、16 CU RDNA 3+ 图形适配器和 45 TOPS 神经引擎。» Further information can be found in our Comparison of Mobile Processsors.
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