Schenker XMG CORE 16 (L23)
Specifications

Memory
32 GB  
, 2x 16 GB SK Hynix DDR5-5600
Display
16.00 inch 16:10, 2560 x 1600 pixel 189 PPI, BOE0AF0 (), IPS, glossy: no, 240 Hz
Mainboard
AMD Promontory/Bixby FCH
Storage
Samsung 990 Pro 1 TB, 1024 GB  
, 860 GB free
Soundcard
AMD Zen - Audio Processor - HD Audio Controller
Connections
1 USB 2.0, 2 USB 3.0 / 3.1 Gen1, 1 USB 3.1 Gen2, 1 HDMI, 1 DisplayPort, 1 Kensington Lock, Audio Connections: Headset jack, Card Reader: Full SD Card Reader
Networking
Realtek Semiconductor RTL8168/8111 PCI-E Gigabit Ethernet NIC (10/100/1000MBit/s), Intel Wi-Fi 6 AX200 (a/b/g/n = Wi-Fi 4/ac = Wi-Fi 5/ax = Wi-Fi 6/), Bluetooth Bluetooth 5
Size
height x width x depth (in mm): 26.1 x 358.4 x 266.8
Battery
99 Wh Lithium-Polymer
Operating System
Microsoft Windows 11 Pro
Camera
Webcam: Full-HD Webcam
Primary Camera: 2 MPix
Additional features
Speakers: Stereo Speaker, Keyboard: mechanical keyboard with RGB backlight, Keyboard Light: yes, 24 Months Warranty, Pickup and Return
Weight
2.39 kg, Power Supply: 628 g
 
Price comparison
									
                    Schenker XMG CORE 16 (L23)
                    Average Score: 90.1% - very good
Average of 
                    2 scores (from
                        2 reviews)
price: - %, performance: 94%, features: 77%, display: 90% mobility: 86%, workmanship: 86%, ergonomy: 84%, emissions: 85%
Reviews for the Schenker XMG CORE 16 (L23)
91% Ryzen 7 rockt die gehobene MittelklasseSource: 
Basic Tutorials  DE→zh-CN
 DE→zh-CN Single Review, online available, Long, Date: 11/13/2023
Rating: Total score: 91% performance: 90% features: 90% display: 90% mobility: 100% workmanship: 90%
  Leistungsfähiges AMD-Notebook für GamerSource: 
HardwareLuxx  DE→zh-CN
 DE→zh-CN Single Review, online available, Long, Date: 11/13/2023
 Comment
NVIDIA GeForce RTX 4070 Laptop GPU: 
基于 Ada Lovelace 架构的笔记本电脑高端显卡。提供 8 GB GDDR6(128 位),可配置为 35 - 115W(+ 动态升压)的 TGP。
 
» Further information can be found in our Comparison of Mobile Graphics Cards and the corresponding Benchmark List.
R7 7840HS: 基于 Zen 4 架构的高端 8 核移动处理器。CPU 内核主频高达 5.1 GHz,可同时执行 16 个线程。集成了 XDNA Ai-Engine。TDP 可在 35 和 54 瓦之间配置。» Further information can be found in our Comparison of Mobile Processsors.