Schenker VIA 14 Pro (L23)
Specifications

Price comparison
Average of 1 scores (from 2 reviews)
Reviews for the Schenker VIA 14 Pro (L23)
Source: Chip.de
DE→zh-CNSingle Review, online available, Long, Date: 02/05/2024
Rating: Total score: 94% price: 84% performance: 100% features: 97% display: 96% mobility: 85% ergonomy: 91%
Source: HardwareLuxx
DE→zh-CNSingle Review, online available, Long, Date: 02/04/2024
Comment
AMD Radeon 780M:
Ryzen 7040 移动系列 APU 中的集成显卡基于 RDNA3 架构,具有 12 个 CU(= 768 个着色器),时钟速度高达 3 GHz。
» Further information can be found in our Comparison of Mobile Graphics Cards and the corresponding Benchmark List.
R7 PRO 7840HS: 基于 Zen 4 架构的高端 8 核移动处理器。CPU 内核主频高达 5.1 GHz,可同时执行 16 个线程。集成了 XDNA Ai-Engine。TDP 可在 35 和 54 瓦之间配置。» Further information can be found in our Comparison of Mobile Processsors.
