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Honor Magic V Flip 2

Honor Magic V Flip 2
Honor Magic V Flip 2
本页面提供关于 Honor Magic V Flip 系列的 Magic V Flip 2 笔记本电脑的评测和其他相关信息。

Specifications

Honor Magic V Flip 2
Processor
Qualcomm Snapdragon 8 Gen 3 8 x 2.3 - 3.3 GHz, Cortex-X4 / A720 / A720 / A520 (Kryo)
Graphics adapter
Memory
12 GB 
, or 16GB
Display
6.82 inch 21:9, 2868 x 1232 pixel 458 PPI, Capacitive, OLED, Cover display: 4 inches, OLED, 120Hz, glossy: yes, 120 Hz
Storage
256GB / 512GB / 1TB
Connections
USB-C Power Delivery (PD), 1 Infrared, 1 Fingerprint Reader, NFC, Sensors: gyro, accelerometer, proximity (ultrasonic), compass
Networking
802.11 a/b/g/n/ac/ax (a/b/g/n = Wi-Fi 4/ac = Wi-Fi 5/ax = Wi-Fi 6/), Bluetooth 5.4, GSM, CDMA, UMTS, LTE, 5G, Dual SIM, GPS
Size
height x width x depth (in mm): 6.9 x 167.1 x 75.6
Battery
5500 mAh Lithium-Polymer
Operating System
Android 15
Camera
Primary Camera: 200 MPix + 50MP
Secondary Camera: 50 MPix
Additional features
Keyboard: OnScreen
Weight
204 g

 

Price comparison

Reviews for the Honor Magic V Flip 2

Honor Magic V Flip 2 Review: Redefining Foldables with a 200MP Camera
Source: Igeekphone English EN→zh-CN
After putting the Honor Magic V Flip2 through a series of tests, it’s clear that Honor has taken big steps forward compared to its previous generation. The focus this time has been on refining the camera system, boosting battery capacity, enhancing external screen functions, and improving the overall build and feel of the device. The first thing that stands out is the upgraded camera setup. Honor has managed to equip the Flip2 with the only 200MP main camera in the compact foldable category, paired with a 50MP ultra-wide lens. This is a massive leap from the earlier version and puts it on par with traditional flagship bar-style phones. Thanks to its foldable form, the main camera also doubles as one of the best selfie shooters you can get today.Next is endurance.
Single Review, online available, Very Long, Date: 08/22/2025

Comment

Qualcomm Adreno 750: 这是一款用于智能手机和平板电脑的图形芯片,集成在高通公司 Snapdragon 8 Gen 3 SoC 中。高通公司声称,它比骁龙 8 代 2 中的 Adreno 7340 快 25%,而首次基准测试显示,该 GPU 可以击败Apple A17 Pro iGPU。

 

» Further information can be found in our Comparison of Mobile Graphics Cards and the corresponding Benchmark List.


SD 8 Gen 3: 2022 年底推出的用于智能手机的高端 SoC,拥有一个基于 ARM Cortex-X3 架构的快速主内核,主频高达 3.2 GHz。另外两个高性能内核基于 A715,也仅支持 64 位应用。另外两个 A710 内核与节能型 Cortex-A510 内核一样,也支持 32 位应用。除处理器内核外,SoC 还集成了 WiFi 7 调制解调器、Hexagon DSP(用于人工智能加速)和 Spectra ISP。集成内存控制器支持高达 4200 MHz 的快速 LPDDR5x 内存。芯片中的骁龙 X70 调制解调器支持 5G。» Further information can be found in our Comparison of Mobile Processsors.


 

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Honor 400 Pro
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Ninh Duy (Update: 2025-10-12)